| 摘要 |
PROBLEM TO BE SOLVED: To efficiently discharge the heat of a three-dimensional lamination semiconductor integrated circuit device without forming a micro passage in a semiconductor chip, relating to a cooling module, a lamination semiconductor integrated circuit device, and a method of manufacturing the cooling module.SOLUTION: A plurality of heat conductive rods are provided in two-dimensional matrix, at a body part containing a channel through which a refrigerant flows, so as to match with lamination pitch and array pitch of conductive joint members provided to a semiconductor integrated circuit chip which is to be applied. |
