| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for mounting a semiconductor element capable of avoiding occurrence of failure, and being excellent in mass productivity of a surface mounting type semiconductor device, with production being stable.SOLUTION: A method of manufacturing a substrate for mounting a semiconductor element includes a step (1) for preparing a base substrate 3 in which a second metal layer 2 where mounting metal is hard to diffuse is formed on a first metal layer 1, a step (2) for forming a resist mask layer 4 having been patterned on the second metal layer 2 of the base substrate 3, a step (3) for forming a re-processing surface by performing re-processing of the second metal layer 2 exposed from the resist mask layer 4, a step (4) for applying the re-processing surface of the base substrate 3 with an organic coat 6 which controls adhesiveness by a chemical liquid containing a component having physical property of ampholytic surface active agent, a step (5) for forming a mounting metal layer 7 through the organic coat 6 on the re-processing surface of the base substrate 3, a step (6) for forming a semiconductor element mounting part and an electrode terminal part 12 by electrocasting on the mounting metal layer 7, and a step (7) for removing the resist mask 4 on the second metal layer 2 of the base substrate 3. |
