SEMICONDUCTOR ELEMENT, METHOD OF FORMING THE SAME, SEMICONDUCTOR PACKAGE, AND ELECTRONIC SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element, a semiconductor package, and an electronic system.SOLUTION: A semiconductor element includes a substrate having a front surface, a rear surface facing the front surface, and a plurality of side surfaces connecting the front surface and the rear surface. An internal circuit is disposed on the front surface or near the front surface of the substrate. A signal input/output through-via structure is disposed in the substrate. A rear-surface conductive pattern that is electrically connected to the signal input/output through-via structure is disposed on the rear surface of the substrate. A rear-surface conductive structure spaced apart from the signal input/output through-via structure is disposed on the rear surface of the substrate. The rear-surface conductive structure includes a plurality of supporter portions that are parallel to each other.