| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a solid state imaging device in which bumps can be made in fine intervals.SOLUTION: On an image sensor substrate 11 having an image sensor, a peripheral circuit region 16 including at least one circuit 15, out of a drive circuit and a signal processing circuit of the image sensor, is provided on the periphery of the imaging region. In order to relay an electric signal for the circuit 15, a plurality of relay connections 20, arranged while exposing partially, are provided on the outside of the peripheral circuit region 16. On the peripheral circuit region 16, a plurality of resin protrusions 25 are provided. The resin protrusions 25 are arranged zigzag in two rows, and covered with metal wiring 26 connecting respective relay connections 20 thus constituting a connection bump 13.</p> |
