| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging device capable of reducing costs by enabling reduction of the number of components.SOLUTION: An imaging device 1 comprises: a lens mount 11 that exchangeably holds a photographing lens 3; a mount base 12 to which the lens mount 11 is attached; a semiconductor chip 31 that has an imaging area; and a rigid printed board 32 that is bump-joined with the semiconductor chip 31, and attached to the mount base 12 not via a plate-like support member. |
