发明名称 ASYMMETRIC GROOVE SHAPE WAFER CASSETTE
摘要 PROBLEM TO BE SOLVED: To provide an asymmetric groove shape wafer cassette capable of easily accommodating a substrate such as a semiconductor wafer in a warped shape and suppressing flapping of the substrate within a groove.SOLUTION: A plurality of substrate support plate-like parts 50 provided on one sidewall of an asymmetric groove shape wafer cassette 1 extend in a direction crossing a normal of one inner face 255. A plurality of substrate support plate-like parts 60 provided on another sidewall are formed asymmetric to the plurality of substrate support plate-like parts 50 provided on the one side wall, thereby a shape of a groove 256 between the substrate support plate-like parts 50 on the one sidewall and a shape of a groove 266 between the substrate support plate-like parts 60 on the other sidewall are different.
申请公布号 JP2014216628(A) 申请公布日期 2014.11.17
申请号 JP20130095920 申请日期 2013.04.30
申请人 MIRAIAL KK;NICHIA CHEM IND LTD 发明人 SATO KYOHEI;FUROCHI YASUHIRO
分类号 H01L21/673;B65D85/86 主分类号 H01L21/673
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