发明名称 WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which can stably activate a semiconductor element.SOLUTION: In a wiring board A in which an electronic component D having a rectangular shape when viewed from above is housed in an electronic component housing hole 5 formed in an insulation layer 1a in a state where an adhesive resin R covers a lower face of the electronic component D, the electronic component housing hole 5 includes a protrusion part E on a lateral face opposite to a central part of a long side of the electronic component D, which protrudes outward from the electronic component housing hole 5 when viewed from above and a part of the adhesive resin R is pushed out and stored in the protrusion part E.
申请公布号 JP2014216580(A) 申请公布日期 2014.11.17
申请号 JP20130094809 申请日期 2013.04.27
申请人 KYOCER SLC TECHNOLOGIES CORP 发明人 TSUJI HIROMI
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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