| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method capable of decreasing the number of formation of processing traces than before, without causing failure in dividing a substrate with a pattern.SOLUTION: In a method of processing a substrate with a pattern in which a plurality of unit patterns are repeatedly arranged in two-dimension on a single crystal substrate, a division start point formation step for forming a division start point on the substrate by radiating laser light along a processing scheduled line set on the substrate includes a crack extension processing step in which, by radiating laser light while scanning along the processing scheduled line, processing traces formed on the substrate with a pattern by respective unit pulse lights of the laser light are positioned in a discrete manner along the processing schedule line, with a crack extending from respective processing traces to the substrate with a pattern. In the division start point formation step, the crack extension processing step is intermittently performed along the processing scheduled line so that a first region in which the processing traces are formed with constant intervals and a second region in which no processing trace is formed are alternately formed. |
