发明名称 RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To dispose electromagnetic-wave shielding sheets so that an electromagnetic wave does not leak.SOLUTION: A resin molding 1 includes: a molding body 10 obtained by molding a resin material, and having a tabular portion 11 and first to three ribs 21 to 23 protruding from the tabular portion 11; and a plurality of electromagnetic-wave shielding sheets S1 to S4 disposed on the molding body 10. The electromagnetic-wave shielding sheets S1 to S4 are disposed along the tabular portion 11, and end portions of the electromagnetic-wave shielding sheets S1 to S4 are disposed along the ribs 21 to 23.
申请公布号 JP2014216627(A) 申请公布日期 2014.11.17
申请号 JP20130095876 申请日期 2013.04.30
申请人 DAIKYONISHIKAWA CORP 发明人 ENOKIDA TOMOSHI
分类号 H05K9/00;B29C45/14;B60K1/04;H01M2/02 主分类号 H05K9/00
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