| 摘要 |
PROBLEM TO BE SOLVED: To provide a method in which occurrence of cracks can be significantly suppressed when a through-hole is formed in a glass substrate using a laser.SOLUTION: A method for forming a through-hole in a glass substrate using a laser comprises (a) a step of installing resin films on a first surface and a second surface of a glass substrate respectively to form a workpiece, and (b) a step of radiating a first laser beam onto a first radiation area of the workpiece to form a through-hole through the glass substrate from the first surface to the second surface. In the method, the step of (b) comprises (c) a step of heating a second radiation area including the first radiation area of the workpiece to a temperature in a range of 100°C to 200°C by using local heating means before the first laser beam is radiated onto the first radiation area of the workpiece. |
