| 摘要 |
PROBLEM TO BE SOLVED: To reduce the stress generated in solder (solder layer) by temperature change as much as possible, in a beam lead to be connected with the electrode of a power element chip by soldering.SOLUTION: In a beam lead 9 to be connected with electrodes 19, 21 of power element chips 5, 7 by means of solders 45, 47, connections 13, 15 to be connected with the power element chips are provided with at least any one of a notch 29 and a through hole 27 for relaxing the stress generated in the solder. |
