发明名称 OPTICAL ELEMENT MODULE
摘要 PROBLEM TO BE SOLVED: To suppress variations in optical characteristics caused by contamination of bubbles in a thermosetting resin member packed between an electronic element for emitting/receiving light and a lens in an optical element module.SOLUTION: In an optical element module 100 in which an electronic element 120 is mounted in a cavity 113 formed on a substrate 110 and a lens 130 is installed on an opening of the cavity 113, a thermosetting resin member 140 having translucency or light diffusion property fills the cavity 113. The opening of the cavity 113 in the substrate 110 is formed so that the resin member 140 packed in the cavity 113 is exposed to the outside air at a part of the opening.
申请公布号 JP2014216385(A) 申请公布日期 2014.11.17
申请号 JP20130090530 申请日期 2013.04.23
申请人 EAGLE INDUSTRY CO LTD 发明人 WATANABE MITSUHIKO
分类号 H01L33/54;H01L31/02;H01L31/0232 主分类号 H01L33/54
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