发明名称 Multi-layered ceramic electronic parts and fabricating method thereof
摘要 <p>There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm.</p>
申请公布号 KR101462754(B1) 申请公布日期 2014.11.17
申请号 KR20130008259 申请日期 2013.01.24
申请人 发明人
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
代理机构 代理人
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