METHOD OF MEASURING SQUEEZE DIRECTION OF SOLDER PASTE

摘要

Disclosed is a squeeze direction measuring method of solder paste. The squeeze direction measuring method of solder paste by the present invention includes the steps of: measuring the coordinates of the gravity center of solder paste attached to at least one pad upper part; measuring the central coordinates of a pad; projecting the coordinates of the gravity center of the solder paste onto the plane of the center coordinates of the pad; and obtaining the squeeze direction vector of the solder paste by deducting the center coordinates of the pad from the coordinates of the gravity center of the projected solder paste.