BONDING DEVICE

摘要

The present invention relates to a bonding device having a main purpose of enhancing productivity and saving equipment as compared with a conventional device by improving a structure to bond a dual panel where two or mode tags are overlapped as compared with a device for receiving two panels and bonding them. The bonding device for bonding the contact points of a touch panel tag and a display panel tag in the dual panel (a panel overlapping the touch panel with the display panel) comprises a preliminary pressing part aligning the contact points of the touch panel tag with the contact points of the display panel tag where the ACF is covered and preliminarily pressing them; and a main pressing part practically pressing the contact points of the touch panel tag and the display tag which are preliminarily pressed, wherein the ACF part and the preliminary pressing part have characteristics which are described in detail in the description of the preferred embodiment.