| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
The present invention has a tray corresponding to a heat sink, a circuit part is accommodated in an accommodating part of the tray, and the circuit part is potting-sealed with a sealing resin such that external electrodes are exposed. The sealing resin covers and seals a top part of the tray. |
| 申请公布号 |
KR20140131959(A) |
申请公布日期 |
2014.11.14 |
| 申请号 |
KR20147025468 |
申请日期 |
2013.03.21 |
| 申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
FUJINO JUNJI;KASHIBA YOSHIHIRO;OGAWA SHOHEI |
| 分类号 |
H01L23/28;H01L21/56;H01L23/34;H01L23/48 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
