CURRENT APPLYING DEVICE

摘要

A current applying device in which a contact electrode is destroyed firstly when a large current is applied in the event of failure. A probe device is configured by serially connecting a contact body that is to be in contact with the surface of a power semiconductor to apply a current and a pressing body assembly that presses the contact body so as to apply the current to the power semiconductor and is configured so that, when the pressing body power applied to the pressing body assembly is smaller than the withstand power of the pressing body assembly, the contact body power applied to the contact body is larger than the withstand power of the contact

主权项

1. A current applying device which is configured by serially connecting a contact electrode which is to be in contact with a surface of a semiconductor to apply a current and a pressing body which presses the contact electrode and applies the current to the semiconductor,
wherein the current applying device is configured so that when the pressing body power applied to the pressing body is smaller than the withstand power of the pressing body, the contact electrode power applied to the contact electrode is larger than the withstand power of the contact electrode.