SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDUCTOR PACKAGE

摘要

A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is opposite to the first surface. A second flange also has a first surface and a second surface, with the first surface providing a second one of the terminations, and the second surface is opposite to the first surface. A die is mounted to the second surface of the first flange with a material having a melting point in excess of 240° C. An electrical interconnect extends between the die and the second surface of the second flange opposite the termination surface, such that the electrical interconnect, first flange and second flange are substantially housed within a body.

主权项

1. A method of packaging a semiconductor die (SD), comprising:
(a) placing a first component on an adhesive substrate, the first component comprising the SD mounted to a first element that is selected from a group consisting of a first flange and a printed circuit board (PCB); (b) placing a second flange on the adhesive substrate adjacent to but spaced apart from the first component; (c) electrically interconnecting the SD and the second flange with an electrical interconnect; (d) housing at least portions of the first component and the second flange by encapsulation with an encapsulation material to form an assembly surrounding the first component and the second flange; and (e) housing the first component and the second flange and the electrical interconnect such that the SD has a power capacity of greater than about 30 W.