| 发明名称 |
Heat Sink For Cooling Power Electronics |
| 摘要 |
A heat sink device for cooling a power electronics module includes a base platform having a first surface and a second surface on opposite sides of the base platform, a plurality of upright members extending outwardly from the first surface of the base platform and defining a cavity wherein the power electronics module is disposed in conductive heat exchange relationship with the first surface of the base platform, and a plurality of heat transfer fins extending outwardly from the second surface of the base platform and defining a plurality of cooling air flow channels. |
| 申请公布号 |
US2014332182(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
US201214117386 |
申请日期 |
2012.04.12 |
| 申请人 |
Taras Michael F.;Lee KeonWoo;Perkovich Mark J.;Duraisamy Suresh;Liao XuQiang |
发明人 |
Taras Michael F.;Lee KeonWoo;Perkovich Mark J.;Duraisamy Suresh;Liao XuQiang |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat sink device for cooling a power electronics module comprising:
a base platform having a first surface and a second surface on opposite sides of the base platform; a plurality of upright members extending outwardly from the first surface of the base platform and defining a cavity wherein the power electronics module is disposed in conductive heat exchange relationship with the first surface of the base platform; a plurality of heat transfer fins extending outwardly from the second surface of the base platform and defining a plurality of cooling air flow channels. |
| 地址 |
Fayetteville NY US |
