METHOD AND APPARATUS FOR PRODUCING THREE-DIMENSIONAL DECORATION PIECE MADE OF THERMOPLASTIC SYNTHETIC RESIN

摘要

A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.

主权项

1. A method for producing a three-dimensional decoration piece of thermoplastic synthetic resin comprising:
putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table to press the upper layer material, emitting a high frequency wave for dielectric heating, to form a three-dimensionally formed body from the upper layer material by molding and fusion-cutting and temporarily holding the three-dimensionally formed body to the upper mold; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold temporarily holding the three-dimensionally formed body; and lowering said upper mold onto the second table to press the three-dimensionally formed body cutting the lower layer material and tacky bonding the three-dimensionally formed body and the lower layer material, so that the lower layer material is not subjected to any high frequency dielectric heating, and is not heated.