| 摘要 |
Provided is an LED module encapsulation automatic complete apparatus comprising six parts that are a feed mechanism (21), a lens covering mechanism (22), a discharge mechanism (23), a side pressing mechanism (24), a glue pouring mechanism (25) and a transmission mechanism (26 ) for an LED module encapsulation. Conversion and integration of an LED substrate among encapsulation processes including a feeding process, a lens covering process, a discharging process, a side pressing process and a glue pouring process are achieved. According to the LED module encapsulation automation complete apparatus, the feed mechanism, the discharge mechanism and the transmission mechanism are added on the basis of a traditional LED module with a side pressing apparatus, a lens covering apparatus and a glue pouring apparatus, meanwhile, interfaces between the existing apparatus and each of the automation feed mechanism, the discharging mechanism and the transmission mechanism are designed, so that integration of all the apparatuses and encapsulation automation of the LED module are achieved. Not only encapsulation efficiency of the LED module is improved, but also labor cost is reduced at the same time. |
