TRANSPARENT-CIRCUIT-BOARD MANUFACTURING METHOD

摘要

This invention provides a transparent-circuit-board manufacturing method that makes it possible to perform desired patterning in a clean fashion while reducing outgassing due to a temporary affixing material even if a high-temperature treatment with a temperature of 200°C or more, for example, is performed. This transparent-circuit-board manufacturing method includes the following steps: a laminate-preparation step in which a laminate comprising a transparent workpiece temporarily affixed to a support with a temporary affixing material interposed therebetween is prepared; a patterning step in which patterning that includes a heat treatment using a temperature of 200°C or more is used to form a pattern on the transparent workpiece, yielding a transparent circuit board; and a separation step in which the transparent circuit board is separated from the temporary affixing material. Part of the temporary affixing material is formed from at least a polyimide or a polyamide-imide.