| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal conductive bonding material having excellent thermal conductivity and that can alleviate stress, and to provide a semiconductor device using the same.SOLUTION: A thermal conductive bonding material 1 is configured by plain-weaving a first fiber group 2a and a second fiber group 2b. The fiber groups 2 (2a and 2b) have such a configuration that a coating material 4 is formed on a surface of a metal fiber 3 to be a core material for the purpose of improving the adhesive property and thermal conductivity between the metal fibers 3. Thereby, an effect as a bonding member that can efficiently radiate heat generated at a power semiconductor element and the like, can be obtained. |
