发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component the reliability of which can be improved, while embodying high capacity, by preventing the electronic component from falling or chipping when being mounted on a board, and to provide the mounting board.SOLUTION: A multilayer ceramic electronic component includes a ceramic body 10 of hexahedron including a dielectric layer 11 and satisfying a relation T/W>1.0, where L is the length, W is the width and T is the thickness, and first and second internal electrodes 21, 22 laminated to face each other via the dielectric layer in the ceramic body 10.
申请公布号 JP2014212295(A) 申请公布日期 2014.11.13
申请号 JP20130213493 申请日期 2013.10.11
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM MI YOUNG;ONO MASAAKI;CHOI JAE YEOL;KIM WI HEON;KIM SANG HUK
分类号 H01G4/12;H01G2/06;H01G4/232;H01G4/30 主分类号 H01G4/12
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