| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem in a conventional semiconductor device manufacturing method that it is difficult to adjust the timing of pulling out a support pin during molding so as to generate a cavity when hardening of a molding resin progresses because the resin does not flow sufficiently into the space where the pin has existed, or to move an insert component when the pin is pulled out too quickly on the contrary because the fluidity of the resin is too high to let the resin rush into the space where the pin has existed.SOLUTION: A semiconductor device manufacturing method according to the present embodiment is a semiconductor device manufacturing method of melting a thermosetting resin and injecting the molten thermosetting resin into a mold to seal an insert component provided in the mold, in which the insert component is supported and sealed by using an element obtained by packing the thermosetting resin in an uncured state. |
