| 摘要 |
PROBLEM TO BE SOLVED: To exfoliate a protective tape without splitting a wafer even when a diameter of the wafer is large.SOLUTION: In an adhesion step, while a non-adhesion region 233 of an exfoliation tape 23 protrudes from a protective tape 21, the exfoliation tape 23 is adhered to the protective tape 21. At that time, the exfoliation tape 23 is adhered to the protective tape 21 in plural adhesion regions 231a-231k spaced from each other in an arc-like shape along an outer periphery of the protective tape 21. In an exfoliation step, the exfoliation tape 23 is pulled while holding the non-adhesion region 233, so as to exfoliate the protective tape 21 to which the exfoliation tape 23 is adhered from a wafer 22. At that time, the exfoliation tape 23 is inverted, and pulled toward a center from an outer periphery of the wafer, so as to sequentially apply a force to the plural adhesion regions 231a-231k and exfoliate the protective tape 21 from the wafer 22. |
