| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a hollow package which further increases the integration density of wiring.SOLUTION: A hollow package for a solid state image sensor 10 includes: a metal base plate 11; a resin frame 12 which is disposed on a surface of the base plate 11 and forms a recessed part, in which an image sensor 14 is to be disposed, on the base plate 11; and a flexible printed circuit board 13 which has an insulative sheet 131 and wiring 132 patterned on a surface of the insulative sheet 131 and is bent at an edge of the base plate 11 to be disposed on a front surface and a rear surface of the base plate 11. The wiring 132 forms an inner lead exposed on the front surface of the base plate 11 in the recessed part and an outer lead exposed on the rear surface of the base plate 11.</p> |
