SEMICONDUCTOR PACKAGE HAVING INTEGRATED ANTENNA PAD

摘要

An apparatus for a semiconductor-package includes a semiconductor device having a radio frequency (RF) input or output, an antenna pad, and a package structured to house the semiconductor device and the antenna pad. The antenna pad may be coupled to the radio frequency (RF) input or output, and the antenna pad is structured to reduce the inductance of the package. The antenna pad may include a pad disposed above the semiconductor device, a pad disposed to a side of the semiconductor device, or an antenna chip. An antenna may be coupled to the antenna pad. The antenna may include a trace antenna, a staggered antenna, or a helical antenna.

主权项

1. A device comprising:
a substrate; an integrated circuit (IC) comprising a radio frequency (RF) circuit mounted on the substrate; a compound encapsulating the IC; a plurality of external contacts at least partially uncovered by the compound coupled to the IC; an antenna pad located on the substrate coupled to the RF circuit; and an antenna situated on the substrate coupled to the antenna pad.