| 发明名称 |
E-FUSE WITH HYBRID METALLIZATION |
| 摘要 |
A structure including a first interconnect including a first line overlying a first via and a second interconnect including a second line overlying a second via. The first line and the second line are co-planar. The first interconnect comprises a first conductor, the first conductor comprises a metal silicide including titanium silicide, cobalt silicide, nickel silicide, tungsten silicide, platinum silicide, molybdenum silicide, tantalum silicide, or some combination thereof. The second interconnect comprises a second conductor, the second conductor comprising copper. |
| 申请公布号 |
US2014332924(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
US201414291027 |
申请日期 |
2014.05.30 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Bao Junjing;Bonilla Griselda;Choi Samuel S.;Filippi Ronald G.;Lustig Naftali E.;Simon Andrew H. |
| 分类号 |
H01L23/525;H01L21/768 |
主分类号 |
H01L23/525 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure comprising:
a first interconnect including a first line overlying a first via; and a second interconnect including a second line overlying a second via; wherein the first line and the second line are co-planar; wherein the first interconnect comprises a first conductor, the first conductor comprises a metal silicide including titanium silicide, cobalt silicide, nickel silicide, tungsten silicide, platinum silicide, molybdenum silicide, tantalum silicide, or some combination thereof; and wherein the second interconnect comprises a second conductor, the second conductor comprising copper. |
| 地址 |
Armonk NY US |
