SEMICONDUCTOR DEVICE WITH BOND AND PROBE PADS

摘要

A semiconductor die has an active face with an arrangement of I/O pads around its edges. The I/O pads include bond pads and probe pads. Two types of I/O pads are provided and the two types of pads are arranged in a staggered arrangement around the edges of the die. The first type of I/O pad has bond pads that are spaced from the probe pads and connected with an interconnecting member. The second type of I/O pads has bond pads that are adjacent to and abutting probe pads. Providing two types of I/O pads and the staggered arrangement of the I/O pads reduces the area of the I/O pads and underlying I/O regions, which saves core area of the die.

主权项

1. A semiconductor device, comprising:
external contact elements for connection to external electrical circuits; and a semiconductor die having outer edges and an active face including first and second types of input/output (I/O) pads arranged along the die edges,
wherein the first type of I/O pads comprise a bond pad, a probe pad spaced from the bond pad, and an interconnect member connecting the bond pad with the probe pad,wherein the second type of I/O pads comprise a bond area and a probe area adjacent to and abutting the bond area,wherein the first and second types of I/O pads are staggered in an alternating arrangement around the edges of the die such that the bond pads of the first type of I/O pads form a first row of pads adjacent to the die edges, the probe pads of the first type of I/O pads form a second row of pads spaced from the edges of the die, and the second type of I/O pads form an intermediate row of pads, andwherein there is an I/O region underlying at least two of the rows and connected electrically with the first and second types of I/O pads.