ELECTRIC CURRENT APPLICATION METHOD AND ELECTRIC CURRENT APPLYING DEVICE

摘要

An electric current application method for applying electric current to a power semiconductor 100 having a first signal pin contact region 102 that conducts a first electric current, and a contacting body contact region 101 that electrically connects with the first signal pin contact region 102 and conducts a second electric current, includes a Step S1 of contacting a first signal pin 32 of a probe device 1 to the first signal pin contact region 102 so as to eliminate residual electricity remaining in the first signal pin contact region 102 and contacting body contact region 101; and Steps S3 and S4 of contacting a contacting part 21 of the contacting body 2 of the probe device 1 to the contacting body contact region 101, and conducting the first electric current and second electric current, after Step S1.

主权项

1. An electric current application method of applying electric current to a semiconductor that includes: a first electric current carrying part that conducts a first electric current, and a second electric current carrying part that is electrically connected with the first electric current carrying part and that conducts a second electric current, the method comprising:
a residual electricity eliminating step of contacting a first electrode of an electric current applying device to the first electric current carrying part, and eliminating residual electricity remaining in the first electric current carrying part and the second electric current carrying part; and a main electric current conducting step of contacting a second electrode of the electric current applying device to the second electric current carrying part, and conducting the first electric current and the second electric current, after the residual electricity eliminating step.