| 发明名称 |
SUBSTRATE CLEANING APPARATUS |
| 摘要 |
A substrate cleaning apparatus including a self-cleaning device is disclosed. The substrate cleaning apparatus includes a self-cleaning device configured to clean a cylindrical scrub-cleaning tool that is rubbed against a substrate surface. The self-cleaning device includes a cleaning body having an inner circumferential surface that is shaped along an circumferential surface of the scrub-cleaning tool, and at least one cleaning nozzle configured to eject a cleaning fluid toward the circumferential surface of the scrub-cleaning tool through a gap between the circumferential surface of the scrub-cleaning tool and the inner circumferential surface of the cleaning body. |
| 申请公布号 |
US2014331440(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
US201414260220 |
申请日期 |
2014.04.23 |
| 申请人 |
EBARA CORPORATION |
发明人 |
ISHIBASHI Tomoatsu |
| 分类号 |
H01L21/67 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate cleaning apparatus, comprising:
a substrate holder configured to hold and rotate a substrate; a cylindrical scrub-cleaning tool configured to come into sliding contact with a surface of the substrate; a rotating device configured to rotate the scrub-cleaning tool about its own axis; and a self-cleaning device configured to clean the scrub-cleaning tool, the self-cleaning device including
a cleaning body having an inner circumferential surface that is shaped along an circumferential surface of the scrub-cleaning tool, andat least one cleaning nozzle configured to eject a cleaning fluid toward the circumferential surface of the scrub-cleaning tool through a gap between the circumferential surface of the scrub-cleaning tool and the inner circumferential surface of the cleaning body. |
| 地址 |
Toyko JP |
