| 摘要 |
<p>In the present invention, disclosed is a method for manufacturing a semiconductor device structure. The present invention relates to the method for manufacturing the semiconductor device structure which includes the steps of: fixing an electrode of a semiconductor device to face a plate as a step of fixing the semiconductor device which is a semiconductor light emitting device on the plate; covering the semiconductor device with an encapsulant; forming a lens on the semiconductor device by injecting the encapsulant to a hole by pressurizing the encapsulant using a mask with the hole; and cutting the semiconductor device and the encapsulant with the lens.</p> |
