DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

摘要

An object of the present invention is to provide a double-sided printed wiring board in which a blind via hole can be easily and reliably formed, which can be accurately applied to lands of a surface-mounted component that are arranged at a narrow pitch, and in which an impedance mismatch can be effectively suppressed. The double-sided printed wiring board according to the present invention includes a substrate having an insulating property, a first conductive pattern stacked on a surface of the substrate and having a first land portion, a second conductive pattern stacked on another surface of the substrate and having a second land portion opposing the first land portion, and a blind via hole penetrating through the first land portion and the substrate, in which an average diameter of an outer shape of the first land portion is larger than an average diameter of an outer shape of the second land portion. The blind via hole, the first land portion, and the second land portion preferably have substantially circular outer shapes, and are preferably formed so as to be substantially concentric with each other.

主权项

1. A double-sided printed wiring board comprising:
a substrate having an insulating property; a first conductive pattern stacked on a surface of the substrate and having a first land portion; a second conductive pattern stacked on another surface of the substrate and having a second land portion opposing the first land portion; and a blind via hole penetrating through the first land portion and the substrate, wherein an average diameter of an outer shape of the first land portion is larger than an average diameter of an outer shape of the second land portion.