发明名称 |
Laser Joining Method |
摘要 |
The present invention provides a method for stably and robustly laser-welding transparent resins together without compromising transparency. Before laser welding, the joining surface of at least a second transparent resin is subjected to photooxidation, thereby reducing the laser transmittance without reducing the visible light transmittance. A laser beam in the ultraviolet region at a wavelength of 400 nm or less, or a laser beam with a pulse width of 10 ps or less is irradiated while the second transparent resin is pressurized to perform laser welding. |
申请公布号 |
US2014332157(A1) |
申请公布日期 |
2014.11.13 |
申请号 |
US201214363174 |
申请日期 |
2012.11.28 |
申请人 |
Hitachi, Ltd. |
发明人 |
Arai Satoshi;Senda Takeshi |
分类号 |
B29C65/16 |
主分类号 |
B29C65/16 |
代理机构 |
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代理人 |
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主权项 |
1. A laser joining method, comprising:
a photooxidation-processing step of applying a photooxidation processing onto a second light-translucent resin; and a joining step of causing the photooxidation-processing applied surface of the second light-translucent resin to be opposed to a first light-translucent member, and joining the first light-translucent member and the second light-translucent resin with each other by irradiating the joining surface of the first light-translucent member and the second light-translucent resin with laser light. |
地址 |
Chiyoda-ku, Tokyo JP |