发明名称 Laser Joining Method
摘要 The present invention provides a method for stably and robustly laser-welding transparent resins together without compromising transparency. Before laser welding, the joining surface of at least a second transparent resin is subjected to photooxidation, thereby reducing the laser transmittance without reducing the visible light transmittance. A laser beam in the ultraviolet region at a wavelength of 400 nm or less, or a laser beam with a pulse width of 10 ps or less is irradiated while the second transparent resin is pressurized to perform laser welding.
申请公布号 US2014332157(A1) 申请公布日期 2014.11.13
申请号 US201214363174 申请日期 2012.11.28
申请人 Hitachi, Ltd. 发明人 Arai Satoshi;Senda Takeshi
分类号 B29C65/16 主分类号 B29C65/16
代理机构 代理人
主权项 1. A laser joining method, comprising: a photooxidation-processing step of applying a photooxidation processing onto a second light-translucent resin; and a joining step of causing the photooxidation-processing applied surface of the second light-translucent resin to be opposed to a first light-translucent member, and joining the first light-translucent member and the second light-translucent resin with each other by irradiating the joining surface of the first light-translucent member and the second light-translucent resin with laser light.
地址 Chiyoda-ku, Tokyo JP