发明名称 |
METHOD OF FORMING A GERMANIUM THIN FILM |
摘要 |
A method of forming a germanium thin film on an underlying film includes forming a germanium seed layer by absorbing a germanium on a surface of the underlying film using an aminogermane-based gas, and forming a germanium thin film on the germanium seed layer using a germane-based gas. |
申请公布号 |
US2014331928(A1) |
申请公布日期 |
2014.11.13 |
申请号 |
US201414337603 |
申请日期 |
2014.07.22 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
KAKIMOTO Akinobu;NAKAJIMA Shigeru;HASEBE Kazuhide |
分类号 |
H01L21/67;H01L21/02 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
1. A germanium thin film formation apparatus which forms a germanium thin film on an underlying film, the germanium thin film formation apparatus comprising:
a process chamber which houses an object to be processed having the underlying film on which the germanium thin film is to be formed; a process gas supplying mechanism which supplies gas used for a process into the process chamber; a heating device which heats the object to be processed housed in the process chamber; an exhauster which evacuates the interior of the process chamber; and a controller configured to control the process gas supplying mechanism, the heating device, and the exhauster, wherein the controller controls the process gas supplying mechanism to: supply a aminogermane-based gas to the process chamber to form a germanium seed layer on an underlying film by absorbing a germanium on the surface of the underlying film; and supply a germane-based gas to the process chamber to form a germanium thin film on the germanium seed layer; and wherein the controller controls the heating device to set a process temperature inside the process chamber to a range of 200 to 500 degrees C. |
地址 |
Tokyo JP |