| 发明名称 |
Method for the Production of a Circuit Board involving the Removal of a Subregion thereof, and Use of such a Method |
| 摘要 |
The invention relates to a method for producing a circuit board (1) involving the removal of a subregion (6) thereof. In said method, at least two layers or plies (2, 3, 4, 5) of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply (4) of the circuit board (1) by providing or applying an adhesion-preventing material (7), and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, once the peripheral zones (8) have been separated or entirely cut off, an outer surface (9) of the subregion (6) to be removed is coupled or connected to an external element (11), and the subregion (6) to be removed is separated from the adjacent ply (4) of the circuit board (1) by lifting or displacing the external element (11), thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in an easy and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids (14) in such a circuit board (1). |
| 申请公布号 |
US2014331494(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
US201214362873 |
申请日期 |
2012.12.03 |
| 申请人 |
AT&S Austria Technologie & Systemtechnik Aktiegese llschaft |
发明人 |
Leitgeb Markus;Weidinger Gerald;Schmid Gerhard;Mareljic Ljubomir |
| 分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for the production of a circuit board involving the removal of a subregion thereof, wherein at least two layers or plies of the circuit board are interconnected, and the subregion to be removed is prevented from being connected to an adjacent ply of the circuit board by providing or applying an adhesion-preventing material, and edge regions of the subregion to be removed are separated from adjoining regions of the circuit board, characterised in that, following a separation or severing of the edge regions, an external surface of the subregion to be removed is coupled or connected to an external element, and in that the subregion to be removed is separated from the adjacent ply of the circuit board by a raising or displacement the external element. |
| 地址 |
Leoben AT |
