| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE |
| 摘要 |
An integrated circuit package system includes: providing a mountable structure having a contact pad and an inner pad; mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and connecting the linear through channel exposed on the integrated circuit device second side to the inner pad. |
| 申请公布号 |
US2014335655(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
US201414341578 |
申请日期 |
2014.07.25 |
| 申请人 |
Huang Rui;Chow Seng Guan;Kuan Heap Hoe |
发明人 |
Huang Rui;Chow Seng Guan;Kuan Heap Hoe |
| 分类号 |
H01L23/00;H01L25/00;H01L21/56 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit package system comprising:
providing a mountable structure having a contact pad and an inner pad; mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and connecting the linear through channel exposed on the integrated circuit device second side to the inner pad. |
| 地址 |
Singapore SG |
