ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM AND METHODS OF PRODUCING THE SAME

摘要

Described herein are electronic assemblies including a subassembly film and methods for making the same. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

主权项

1. A method of manufacturing an electronic assembly, comprising:
forming a first subassembly by placing an electronic die at a die placement location on a subassembly film having a first upper and a first lower surface, said die placement location defined by first contacts/traces on said upper surface; forming a second subassembly by placing said first subassembly on a base layer having a second upper surface and second lower surface, the base layer comprising second contacts/traces on said second upper surface, and joining said first subassembly to said base layer; and electrically connecting said first contacts/traces and said second contacts/traces.