| 发明名称 |
CYANATE ESTERS-BASED ADHESIVE RESIN COMPOSITION FOR FABRICATION OF CIRCUIT BOARD AND FLEXIBLE METAL CLAD LAMINATE COMPRISING THE SAME |
| 摘要 |
The present invention relates to an adhesive resin composition for fabrication of circuit boards and its use. The adhesive resin composition of the present invention includes a cyanate ester resin, a fluorine-based resin powder dispersed in the cyanate ester resin, and a rubber component and has low dielectric constant and low dielectric loss factor, which enables the fabrication of circuit boards with further enhanced electrical characteristics. |
| 申请公布号 |
US2014335341(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
US201214364978 |
申请日期 |
2012.12.11 |
| 申请人 |
LG CHEM, LTD. |
发明人 |
Park Young Seok;Park Soon Yong;Jang Se Myung |
| 分类号 |
H05K1/03;H05K1/05;C09J147/00 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An adhesive resin composition for fabrication of a circuit board, comprising:
a cyanate ester resin; and a fluorine-based resin powder and a rubber component dispersed in the cyanate ester resin. |
| 地址 |
Seoul KR |
