APPARATUSES, DEVICE, AND METHODS FOR CLEANING TESTER INTERFACE CONTACT ELEMENTS AND SUPPORT HARDWARE

摘要

A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed so that the functionality and performance of the individual die or IC package may be electrically evaluated.

主权项

1. A test probe cleaning material for cleaning the contact elements and support structures of testing interfaces used for wafer level or package level IC semiconductor device functional testing, the cleaning material comprising:
a cleaning pad layer; one or more intermediate layers underneath the cleaning pad layer, the one or more intermediate layers supporting the cleaning pad layer and having a set of predetermined characteristics of the one or more intermediate layers that are selected to optimize the cleaning material for a particular contact elements and support structures of testing interfaces, wherein a modulus of elasticity has a range between more than 40-MPa to 600-MPa, each layer has a thickness between 25-um and 300-um and each layer has a hardness between 30 Shore A and 90 Shore A; and wherein the intermediate layers further comprises a plurality of abrasive particles having a Mohs Hardness of 7 or greater that are selected to optimize the cleaning material for a particular contact elements and support structures of testing interfaces.