WIRING BOARD UNIT MANUFACTURING METHOD, INSERTION SEAT MANUFACTURING METHOD, WIRING BOARD UNIT AND INSERTION SEAT

摘要

PROBLEM TO BE SOLVED: To provide an art to support ensuring of signal waveform quality and suppression of signal delay at the same time without influencing wiring topology of a wiring board even in the case where memory chips of different sorts are mounted on the wiring board.SOLUTION: A manufacturing method of a wiring board unit including semiconductor packages each having a memory chip, a wiring board and insertion seats inserted between the wiring board and the semiconductor packages comprises: forming on a base material, a plurality of connection part groups each of which includes a plurality of connection parts for electrically connecting board side pads of the wiring board with external terminals of the semiconductor packages and which are alternately used depending on the sort of the memory chip; forming insertion seats by adjusting resistance values of connection parts included in each connection part group in accordance with the sort of the target memory chip; and connecting the external terminals with the board side pads by using the connection part group selected depending on the sort of the memory chip among the plurality of connection part groups on the formed insertion seat.