发明名称 COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To resolve a problem that, because it is expected that miniaturization of an electronic component will further progress in the future, and high-speed, high-accuracy mounting is requested to a component mounting device, and thus, a high-speed operation is requested to an operation shaft of a nozzle for holding the component for the purpose of achieving the high-speed, high-accuracy mounting, it is preferred that the nozzle changes its position to a substrate, and rotates there without changing its position substantially for the high-speed operation, and a conventional art is not sufficient in consideration for this view point.SOLUTION: A component mounting device comprises: a nozzle for mounting a component on a substrate; a first gear formed at the nozzle; a first motor unit for changing a position of the nozzle; a second motor unit including a second gear and provided for making the nozzle rotate; and a third gear for propagating rotation of the second motor unit to the first gear.
申请公布号 JP2014212180(A) 申请公布日期 2014.11.13
申请号 JP20130087032 申请日期 2013.04.18
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 TAKAHIRA ISAO;INOUE TOMOHIRO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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