BIOMEMS AND PLANAR LIGHT CIRCUIT WITH INTEGRATED PACKAGE

摘要

A BioMEMS microelectromechanical apparatus and for fabricating the same is disclosed. A substrate is provided with at least one signal conduit formed on the substrate. A sacrificial layer of sacrificial material may be deposited on the signal conduit and optionally patterned to remove sacrificial material from outside the packaging covered area. A bonding layer may be deposited on at least a portion of the signal conduit and on the sacrificial layer when included. The bonding layer may be planarized and patterned to form one or more cap bonding pads and define a packaging covered area. A cap may be bonded on the cap bonding pad to define a capped area and so that the signal conduit extends from outside the capped area to inside the capped area. Additionally, a test material such as a fluid may be provided within the capped area.

主权项

1. A method for forming a microelectromechanical device, comprising:
forming at least one optical signal conduit over a substrate; forming a patterned sacrificial layer over the optical signal conduit, the patterned sacrificial layer defining a perimeter; forming a pad along the perimeter of the sacrificial layer; planarizing a top surface of the pad; removing the sacrificial layer thereby exposing a sidewall of the pad; bonding a cap over the planarized top surface of the pad thereby forming a controlled environment.