| 发明名称 |
ELECTROSTATIC DISCHARGE DIODE |
| 摘要 |
A method includes thinning a back-side of a substrate to expose a portion of a first via that is formed in the substrate. The method also includes forming a first diode at the back-side of the substrate. The first diode is coupled to the first via. |
| 申请公布号 |
WO2014182449(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
WO2014US35076 |
申请日期 |
2014.04.23 |
| 申请人 |
QUALCOMM INCORPORATED |
发明人 |
RAMACHANDRAN, VIDHYA;HENDERSON, BRIAN M.;GU, SHIQUN;TAN, CHIEW-GUAN;KIM, JUNG PILL;KIM, TAEHYUN |
| 分类号 |
H01L27/06;H01L23/48;H01L23/60;H01L25/065;H01L27/02 |
主分类号 |
H01L27/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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