| 摘要 |
PROBLEM TO BE SOLVED: To provide polarization control of broadband ultra-violet, including deep ultra-violet, flexible brightfield and darkfield imaging system for wafer inspection with high sensitivity and high throughput.SOLUTION: A surface inspection system comprises: a radiation directing assembly to target radiation onto a surface of an object, the radiation directing assembly comprising a polarization control assembly 103 comprising at least one of a linear polarizer 105 and an apochromatic retarder 107, the radiation directing assembly also comprising an aperture control mechanism 109 and a beam splitter 113; a radiation collection assembly to collect radiation reflected from the surface of the object, the radiation collection assembly comprising a polarization control assembly 117 comprising at least one of a linear polarizer 119 and an apochromatic retarder 121, the radiation collection assembly also comprising an aperture control mechanism 123 and at least one radiation sensing device 127. |
