发明名称 SUBSTRATE HEATING MECHANISM, FILM FORMATION DEVICE, AND SUSCEPTOR
摘要 PROBLEM TO BE SOLVED: To provide a substrate heating mechanism which uniformly heats a surface of a substrate and forms a functional film having uniform characteristics on the surface, and to provide a film formation device and a susceptor.SOLUTION: A protrusion 23, which is erected perpendicular to one surface 52a and surrounds a periphery E of a substrate 5 placed on the one surface 52a side, is integrally formed with a susceptor body 21 at the one surface 52a side of the susceptor 52. An inner peripheral surface 23a of the protrusion 23, which faces at least the periphery E of the substrate 5 and spreads along a substantially perpendicular direction, forms a heat reflection surface H which reflects heat. In order to use the inner peripheral surface 23a of the protrusion 23 as the heat reflection surface H, a metal film 22 is formed on an entire inner surface of a recessed part 24 forming the susceptor 52.
申请公布号 JP2014212249(A) 申请公布日期 2014.11.13
申请号 JP20130088505 申请日期 2013.04.19
申请人 ULVAC JAPAN LTD 发明人 MIYAGUCHI ARINORI;MASUDA TAKESHI;ODAJIMA NOBUHIRO;SU HIROTSUNA
分类号 H01L21/31;C23C16/40;C23C16/458;C23C16/46;H01L21/316 主分类号 H01L21/31
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