发明名称 |
RESIN FILM FORMATION METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin film formation method with high reliability where a resin film is closely bonded on an inorganic material.SOLUTION: A resin film formation method comprises the steps of: introducing a carboxyl group or an amino group on the surface of an inorganic material; forming a resin film containing a resin consisting of one of a thermosetting resin and a thermoplastic resin or a combination thereof on an inorganic material introduced with the carboxyl group via a silane coupling agent; adjusting a hydroxyl group density on the surface of the inorganic material to be 4-8 groups/nm; and forming the resin film containing the resin consisting of one of the thermosetting resin and the thermoplastic resin or a combination thereof on the inorganic material adjusted with the hydroxyl group density via a silane coupling agent.</p> |
申请公布号 |
JP2014210259(A) |
申请公布日期 |
2014.11.13 |
申请号 |
JP20140076186 |
申请日期 |
2014.04.02 |
申请人 |
FUJI ELECTRIC CO LTD;FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD |
发明人 |
HIROSE TAKAYUKI;ISONO YOSHINORI |
分类号 |
B05D3/10;B05D7/00;C03C17/34;C04B41/83;C04B41/89 |
主分类号 |
B05D3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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