发明名称 RESIN FILM FORMATION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin film formation method with high reliability where a resin film is closely bonded on an inorganic material.SOLUTION: A resin film formation method comprises the steps of: introducing a carboxyl group or an amino group on the surface of an inorganic material; forming a resin film containing a resin consisting of one of a thermosetting resin and a thermoplastic resin or a combination thereof on an inorganic material introduced with the carboxyl group via a silane coupling agent; adjusting a hydroxyl group density on the surface of the inorganic material to be 4-8 groups/nm; and forming the resin film containing the resin consisting of one of the thermosetting resin and the thermoplastic resin or a combination thereof on the inorganic material adjusted with the hydroxyl group density via a silane coupling agent.</p>
申请公布号 JP2014210259(A) 申请公布日期 2014.11.13
申请号 JP20140076186 申请日期 2014.04.02
申请人 FUJI ELECTRIC CO LTD;FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD 发明人 HIROSE TAKAYUKI;ISONO YOSHINORI
分类号 B05D3/10;B05D7/00;C03C17/34;C04B41/83;C04B41/89 主分类号 B05D3/10
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