| 发明名称 |
FORMING SEMICONDUCTOR CHIP CONNECTIONS |
| 摘要 |
Various embodiments include semiconductor structures. In one embodiment, the semiconductor structure includes a chip having a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape. |
| 申请公布号 |
US2014332929(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
US201414273975 |
申请日期 |
2014.05.09 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Cheng Kangguo;Dalton Timothy J.;Farooq Mukta G.;Fitzsimmons John A.;Hsu Louis L. |
| 分类号 |
H01L23/00;H01L27/02;H01L29/06 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor chip comprising:
a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape. |
| 地址 |
Armonk NY US |
