发明名称 SEMICONDUCTOR DEVICE
摘要 <p>A semiconductor structure includes a device, a conductive pad on the device, and an Ag1-xYx alloy bump. The Y of the Ag1-xYx alloy bump includes a complete solid having a random wt% of Ag. The X of the Ag1-xYx alloy is approximately in a range of 0.005 to 0.25. A difference between an average value and a standard deviation of one of the particle size distribution of the Ag1-xYx alloy is approximately in a range of 0.2μm to 0.4μm. The average particle size of the Ag1-xYx alloy in a vertical cross section is approximately in a range of 0.5μm to 1.5μm.</p>
申请公布号 KR101460914(B1) 申请公布日期 2014.11.13
申请号 KR20130147553 申请日期 2013.11.29
申请人 CHIPMOS TECHNOLOGIES INC. 发明人 CHENG SHIH JYE;LU TUNG BAO
分类号 H01L21/60;H01L23/48 主分类号 H01L21/60
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